Microphone Earbuds
Sep/080
Microphone Earbuds
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There is provided a surface mount parallelepiped condenser microphone. In the surface mount parallelepiped condenser microphone, a case has a rectangular box shape with an opening, a back-plate has a circular shape with a sound hole, a spacer has thin ring shape.
An insulation ring has a hollow cylindrical shape with top and bottom openings, a diaphragm faces the backplate with disposing the spacer therebetween, and a PCB has a rectangular shape with a sound hole at a center portion, the PCB being electrically connected with the diaphragm through a conductive ring, wherein a metal ring, the backplate, the spacer, the insulation ring, the diaphragm, the conductive ring, and the PCB are sequentially disposed in the case, and the case is curled at the opening. Therefore, the direction of the surface mount condenser microphone can be easily detected when mounting on a main PCB.
The surface mount parallelepiped condenser microphone, comprising: a case having a rectangular box shape with an opening; a metal ring insertable into the case; abackplate having a circular shape with a sound hole; a spacer having a thin ring shape; an insulation ring having a hollow cylindrical shape with top and bottom openings; a diaphragm facing the backplate with disposing the spacer therebetween wheninserted in the insulation ring; a conductive ring; and a printed circuit board (PCB) having a rectangular shape with a sound hole at a center portion, the PCB having one side on which a component is mounted and the other side from which a terminal isprotruded, the PCB being electrically connected with the diaphragm through the conductive ring when assembled, wherein the metal ring, the backplate, the spacer, the insulation ring, the diaphragm, the conductive ring, and the PCB are sequentiallydisposed in the case, and the case is curled at the opening.
Typical condenser microphones include a voltage bias component (electret), a pair of diaphragm and backplate, and a junction field effect transistor (JFET). The pair of diaphragm and backplate forms a capacitor of which capacitance varies inresponse to sound pressure. The JFET is used to buffer an output signal.
When mounting the condenser microphone on a main PCB by using a surface mount technology (SMT), the connecting terminals of the PCB of the condenser microphone should be exactly connected with terminals of the main PCB. However, the condensermicrophone is not suitable for using the SMT because leading ends of the connecting terminals are lower than a curled surface of the case. This structure may cause soldering failure. Specifically, since it is difficult to check the positions of theterminals when a plurality of terminals are to be connected to one another, polarity mismatches and poor contacts such as abnormally aligned contacts may be caused.
Accordingly, the present invention is directed to a surface mount parallelepiped condenser microphone that substantially obviates one or more problems due to limitations and disadvantages of the related art.
An object of the present invention is to provide a surface mount condenser microphone that has a sound hole in its PCB and a parallelepiped shape for easy direction finding during the surface mounting process.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may belearned from practice of the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
To achieve these objects and other advantages and in accordance with the purpose of the invention, as embodied and broadly described herein, there is provided a surface mount parallelepiped condenser microphone, including: a case having arectangular box shape with an opening; a metal ring insertable into the case; a backplate having a circular shape with a sound hole; a spacer having a thin ring shape; an insulation ring having a hollow cylindrical shape with top and bottom openings; adiaphragm facing the backplate with disposing the spacer therebetween when inserted in the insulation ring; a conductive ring for electrically connecting the diaphragm to a printed circuit board (PCB); and a printed circuit board (PCB) having arectangular shape with a sound hole at a center portion, the PCB having one side on which a component is mounted and the other side on which a terminal is protruded, wherein the metal ring, the backplate, the spacer, the insulation ring, the diaphragm,the conductive ring, and the PCB are sequentially disposed in the case, and the case is curled at the opening.
As described above, the parallelepiped condenser microphone of the present invention is designed such that mounting direction of the condenser microphone can be easily detected during surface mounting process of the condenser microphone. Therefore, terminals of a main PCB and the terminals of the condenser microphone can be exactly connected to one another without polarity mismatch and abnormal alignment.
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